Overview
IEC TR 62258-7:2007 - "Semiconductor die products - Part 7: XML schema for data exchange" is a technical report from the IEC that defines an XML schema to standardize electronic data exchange for semiconductor die products. The report targets wafers, singulated bare die, die and wafers with attached connection structures, and minimally or partially encapsulated devices. It provides a formal XML representation to help implement procurement, simulation and manufacturing information requirements defined elsewhere in the IEC 62258 series.
Key topics and technical requirements
- XML schema (Annex A): A normative XSD that models the elements needed for die-product data exchange. The schema complies with W3C XML 1.0 (Third edition) and includes typed elements (e.g., NAME_Type, DATE_Type, LENGTH_Type) and enumerations for device form, signal type, units and more.
- Data model alignment: Implements the DDX entities from IEC 62258-2 and extends them by expanding organization information (addresses and contacts) and subdividing certain entities for clarity.
- Support for simulation metadata: Designed to carry information needed to implement requirements from IEC 62258-5 (electrical simulation) and IEC 62258-6 (thermal simulation).
- Examples and guidance: Annex B provides a worked XML example using the schema to illustrate typical data-exchange scenarios.
- Usage and distribution: The electronic schema file (e.g., DDXschema.xsd) is available from the IEC webstore under IEC copyright conditions for legitimate e-commerce and internal use.
Practical applications
- Standardized electronic data interchange (EDI) between die suppliers, OEMs and contract manufacturers.
- Integration of die-product metadata into EDA / CAD tools, PLM and ERP systems to streamline procurement and design-for-manufacture workflows.
- Consistent exchange of attributes needed for electrical and thermal simulation, enabling better design validation and yield forecasting.
- Transmission of manufacturing, test and packaging details (wafer sizes, device form, pin/signal types, geometric units) in a machine-readable format for automated processing.
Who should use it
- Die and wafer manufacturers and their suppliers
- OEM design and procurement teams using bare die or minimally packaged devices
- EDA, PLM and ERP vendors integrating semiconductor part data
- Test houses, assembly, and contract manufacturers exchanging die-level specifications
- Engineers responsible for electrical/thermal simulation and supply-chain data quality
Related standards
Keywords: IEC TR 62258-7:2007, XML schema for data exchange, semiconductor die products, DDX, wafer data exchange, bare die XML, IEC 62258.