Overview
IEC TR 62878-2-2:2015 is a technical report published by the International Electrotechnical Commission (IEC) that provides comprehensive guidelines for electrical testing of device embedded substrates. Device embedded substrates are advanced materials used in electronics manufacturing where active or passive devices are integrated directly within the substrate itself. This standard outlines required electrical tests, such as interconnection open-circuit and short-circuit checks, as well as functional testing of embedded devices. By establishing a structured approach to electrical testing, IEC TR 62878-2-2 helps ensure performance, reliability, and quality for substrates with embedded components in complex electronic assemblies.
Key Topics
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Overview of Test Levels: The guideline categorizes electrical tests into multiple levels based on the complexity and type of embedded devices.
- Level 1 (1A, 1B): Focused on verifying continuity and isolation of interconnections within the substrate and between component nets and wiring nets.
- Level 2 (2A, 2B): Pertains to detailed electrical performance measurements of individual or multiple embedded passive or active components, using specialized equipment such as LCR meters, impedance analyzers, and network analyzers.
- Level 3: Addresses functional testing for substrates where embedded components operate collectively as filters or other circuit blocks, emphasizing overall system performance metrics.
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Test Equipment Selection: Guidance on the use of multi-testers, impedance analyzers, LCR meters, and network analyzers, highlighting the importance of choosing the correct measurement equipment based on the frequency range and device type.
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Test Procedures: Step-by-step instructions for preparing, performing, and reviewing electrical tests on device embedded substrates, including critical details such as design reviews, test interface design, program development, and debugging.
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Specification and Measurement: Emphasis on establishing clear specifications for device embedded substrates and collecting relevant data (design, pad information, block diagrams, electrical parameters) prior to testing.
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Result Evaluation: Recommendations for comparing test outcomes with simulation models, focusing on performance factors such as insertion loss, bandwidth, ripple, rejection, and noise.
Applications
The guidelines in IEC TR 62878-2-2 are essential for industries involved in high-density electronics manufacturing, such as:
- Printed Circuit Board (PCB) Fabrication: Ensuring the viability and reliability of PCBs with embedded active and passive devices.
- Semiconductor Assembly: Supporting the integration and quality assurance of dies or discrete components within organic-based substrates.
- Consumer Electronics: Facilitating functional testing of modules in devices where miniaturization and performance integration are critical.
- Automotive and Industrial Electronics: Enhancing robustness and quality validation for mission-critical modules with embedded sensors, filters, or logic.
- Telecommunications: Optimizing high-frequency substrate performance by robust electrical functional verification.
By applying the outlined electrical test methods, manufacturers and designers can detect latent defects, verify device performance under different conditions, and prevent functional failures in complex embedded substrate assemblies.
Related Standards
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IEC 62878-1: Device embedded substrate - Part 1: Generic specification. This provides the foundational specifications for device embedded substrates, complementing the testing guidelines described in this report.
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IEC 62421: Electronic modules - Reference for exclusions regarding re-distribution layer (RDL) and M-type business model modules.
In conjunction with IEC TR 62878-2-2, these standards create a comprehensive framework for quality assurance, design validation, and reliability assessment in advanced electronics manufacturing and assembly processes.
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