Overview
IEC TR 62878-2-9:2022 is an IEC Technical Report that documents the JISSO (Jisso) concept and the agreed JISSO product levels developed by the Jisso International Council (JIC). This report captures the long‑term discussions (1999–2005) that produced a common framework for describing product states and interfaces in the electronic assembly technology and device embedding assembly technology domains. It is a guidance document (technical report) intended to harmonize terminology and product‑level concepts across suppliers, users and standards activities in IEC TC 91.
Key topics
- Definition of JISSO: “total solution for interconnecting, assembling, packaging, mounting and integrating system design for system integration.”
- JISSO Product Levels (typical) - conceptual classification of physical product states before JISSO processes:
- Level 0 – Intellectual information
- Level 1 – Electronic element
- Level 2 – Electronic package
- Level 3 – Electronic module
- Level 4 – Electronic unit
- Level 5 – Electronic system
- Relationship to Packaging (Interconnecting) Levels: contrasts JISSO product‑level classification with traditional packaging/interconnect levels (chip → package → PCB/module → unit → set).
- Historical context and governance: summarizes JIC formation, stakeholders (e.g., IPC, JEITA, iNEMI, JEDEC), and the intent to align terminology for IEC TC 91 activities.
- Guidance, not normative requirements: the report contains no normative references and is intended as a conceptual guideline to support further standardization and industry alignment.
Applications
IEC TR 62878-2-9:2022 is useful for:
- Electronics manufacturers and assemblers - to align supplier/user communication about product state and assembly scope (element vs. package vs. module).
- Package and PCB designers - to map design responsibilities and interface definitions across product levels.
- Process and manufacturing engineers - to clarify which assembly/embedding processes apply at each JISSO level.
- Standards committees and technical working groups - to provide a common taxonomy when developing or harmonizing standards in device embedding and assembly technology.
- Supply‑chain managers and integrators - to improve procurement specifications, interoperability and requirements definition.
Practical benefits
- Establishes a shared vocabulary for device embedding, assembly, and packaging technologies.
- Helps reduce ambiguity in cross‑discipline communications (supplier ↔ OEM ↔ integrator).
- Supports consistent classification for regulatory, quality and design documentation within the IEC 62878 series.
Related standards and further reading
- Part of the IEC 62878 series on Device embedding assembly technology and developed under IEC TC 91 (Electronics assembly technology). For the latest edition and associated parts, consult the IEC webstore.