Overview
IEC TS 62878-2-1:2015 is an important Technical Specification published by the International Electrotechnical Commission (IEC) that provides guidelines and a general description of device embedded substrate technology. This standard specifically focuses on device embedded substrates fabricated using organic base materials. It encompasses the embedding of active and passive devices, discrete components created during electronic wiring board fabrication, and sheet-formed components.
This document serves as a foundational reference to understand the basic structures, technologies, and manufacturing processes of device embedded substrates, which are crucial in modern electronic packaging and printed circuit board (PCB) designs.
Key Topics
The specification covers a variety of critical aspects of device embedded substrate technology, including:
- Basic Structures: It identifies different configurations of device embedding, such as pad connections and via connections, illustrating with examples how devices integrate within substrates.
- Technology Overview: Detailed explanations of substrate fabrication methods, materials used, and device embedding techniques support engineers in understanding the technology's core principles.
- Jisso Mounting and Interconnection: Describes mounting methods and electrical interconnection techniques used within device embedded substrates, including wire bonding, soldering, copper plating, and conductive resin connections.
- Layer Naming Conventions and Terminology: Establishes a standardized nomenclature for layers, surfaces, insulation thickness, conductor gaps, and electrode connections to ensure consistent communication and documentation.
- Structural Classification: Offers classifications for different embedded device types and integration methods, providing a framework for system designers to select appropriate configurations for their applications.
- Manufacturing Process Guidance: Discusses processes such as embedding using vias or conventional methods to ensure reliable device integration in multi-layer substrates.
Applications
IEC TS 62878-2-1:2015 is highly valuable in areas where integration of devices directly into substrates enhances performance, miniaturization, and reliability. Practical applications include:
- Advanced Printed Circuit Boards (PCBs): Facilitating compact, high-density circuit designs by embedding components within the substrate layers.
- Multilayer Electronic Modules: Enabling device embedding across multiple substrate layers to improve interconnection density and reduce parasitic effects.
- Embedded Passive and Active Components: Improving electrical performance by reducing interconnect lengths and enhancing thermal management.
- Consumer Electronics and Wearables: Allowing for thinner, lighter devices with complex circuitry integrated seamlessly into slim form factors.
- Automotive and Aerospace Electronics: Enhancing reliability and robustness through embedded device protection within substrate structures.
- Medical Devices: Supporting highly integrated and miniaturized electronics required in implantable and portable medical technologies.
Related Standards
Understanding device embedded substrates often requires familiarity with related IEC standards and technical specifications that govern electronic component packaging and PCB manufacturing, such as:
- IEC 61189 Series – Tests and measurements for electrical insulating materials and printed boards.
- IEC 61249 Series – Materials for printed boards and other interconnecting structures.
- IEC 62326 Series – Multimedia substrate technology, which sometimes relates to substrate integration techniques.
- Additional IEC standards addressing passive and active component testing, reliability, and environmental requirements for embedded devices.
By adhering to IEC TS 62878-2-1:2015, manufacturers and designers ensure consistent understanding and implementation of device embedded substrate technology in compliance with international best practices, promoting global interoperability and high-quality electronic products.
Keywords: device embedded substrate, embedded devices, organic base material substrates, electronic wiring board, component embedding, PCB technology, substrate fabrication, interconnection technology, multilayer substrates, active and passive components, IEC standards.