ISO 9453:1990 PDF
Soft solder alloys — Chemical compositions and forms
Soft solder alloys — Chemical compositions and forms
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Количество страниц:
- 4
- Дата публикации:
- 15 ноября 1990 г.
- Издание:
- ISO IS 9453 edition 1 version 1
- ICS:
- 25.160.50
Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.
Технические детали
- Технический комитет
- ISO/TC 44/SC 12 - Soldering materials
- SKU
- ISO 9453:1990