ISO 9453:2006 PDF
Soft solder alloys — Chemical compositions and forms
Название (английский):
ISO 9453:2006
Soft solder alloys — Chemical compositions and forms
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Количество страниц:
- 10
- Дата публикации:
- 22 сентября 2006 г.
- Издание:
- ISO IS 9453 edition 2 version 1
- ICS:
- 25.160.50
Описание (английский):
ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; tin-antimony; tin-bismuth; tin-copper, with and without silver; tin-indium, with and without silver and bismuth; tin-silver, with and without copper and bismuth; tin-zinc, with and without bismuth. ISO 9453:2006 also includes an indication of the forms generally available.
Технические детали
- Технический комитет
- ISO/TC 44/SC 12 - Soldering materials
- SKU
- ISO 9453:2006