ISO 9455-17:2002 PDF
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Количество страниц:
- 21
- Дата публикации:
- 9 декабря 2002 г.
- Издание:
- ISO IS 9455 edition 1 version 1
- ICS:
- 25.160.50
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
Технические детали
- Технический комитет
- ISO/TC 44/SC 12 - Soldering materials
- SKU
- ISO 9455-17:2002