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Workmanship requirements for soldered electronic assemblies. Part 3. Through-hole mount assemblies
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Informational ensuring of equipment and operational activity. Language of operation activity. Morphology
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Fixed capacitors for use in electronic equipment. Part 11. Blanc detail specification. Fixed polyethylene-terephthalate film dielectric metal foil d.c. capacitors. Assessment level E
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Information technology. International Standardized Profiles TB, TC, TD and TE. Connection-mode Transport Service over connection-mode Network Service. Part 11. CSMA/CD subnetwork-dependent, media-dependent requirements
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Photomultipliers. Measuring method of variation of signal transit time in dependence of the position of illuminated part of the photocathode area
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Information technology. Biometrics. BioAPI Interworking protocol
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