Workmanship requirements for soldered electronic assemblies - Surface-mount assemblies
Workmanship requirements for soldered electronic assemblies - Surface-mount assemblies
Мы хотим включить аналитику посещений, чтобы понимать, что искать людям на сайте. Без вашего согласия счётчики не загружаются. Политика конфиденциальности
1 Scope This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting. It does not include metal or ceramic-based hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate.
Упомянутые в описании и другие стандарты BS