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What is BS EN IEC 61188 ‑ 6 ‑ 2 about? BS EN IEC 61188 ‑ 6 ‑ 2 describes the requirements of design and use for soldering surfaces of land patterns on circuit boards. This document includes a land pa…
What is BS EN IEC 61188-6-4 - Surface mounted components (SMDs) about ? BS EN IEC 61188 ‑ 6 ‑ 4 is an international standard used for printed boards and printed board assemblies that specifies the di…
What is BS EN IEC 61188 ‑ 6 ‑ 1 - Circuit boards about? BS EN IEC 61188 ‑ 6 ‑ 1 is the sixth part of the European standard on circuit boards and circuit board assemblies in multi-series. BS EN IEC 61…
Overview IEC 61188-5-3:2007 is an international standard published by the International Electrotechnical Commission (IEC) that addresses the design and use of land pattern geometries for electronic c…
Overview IEC 61188-5-5:2007 is an international standard for PCB designers and electronics assemblers that defines land pattern geometries for components with gull‑wing leads on four sides (quad pack…
Overview IEC 61188-5-4:2007 is an IEC standard that defines component and land‑pattern dimensions for small outline integrated circuits with two‑sided J leads (SOJ) intended for the reflow soldering…
Overview IEC 61188-5-8:2007 - Printed board and printed board assemblies: Attachment (land/joint) considerations - provides guidance on land pattern geometries for area array components including BGA…
Overview IEC 61188-6-2:2021 establishes essential requirements for the design and use of land patterns for surface mounting components (SMD) on circuit boards. Developed by the International Electrot…
Overview IEC 61188-6-4:2019 is an international standard developed by the International Electrotechnical Commission (IEC) that sets out the generic requirements for dimensional drawings of surface mo…
Overview - IEC 61188-7:2017 (Electronic component zero orientation for CAD library construction) IEC 61188-7:2017 is an international standard that defines a consistent technique for describing elect…
Overview IEC 61188-6-1:2021 is an international standard published by the International Electrotechnical Commission (IEC) that provides the generic requirements for land pattern design on circuit boa…
Overview IEC 61188-5-6:2003 is an international standard published by the International Electrotechnical Commission (IEC) focusing on printed boards and printed board assemblies-specifically the desi…
Overview IEC 61188-6-3:2024 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies requirements for the design of land patterns and lands on circ…
Overview IEC 61188-5-2:2003 is an international standard published by the International Electrotechnical Commission (IEC) that provides comprehensive guidance on the design and use of land patterns f…