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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plast…

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of tempe…

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of tempe…

Semiconductor devices. Mechanical and climatic test methods - Neutron irradiation

What is BS EN IEC 60749 ‑ 17 about? BS EN IEC 60749 ‑ 17 is the 17th part of an international standard that covers the attributes of semiconductor devices. This specifies the neutron irradiation test…

Semiconductor devices. Mechanical and climatic test methods - Resistance to soldering temperature for through…

What is BS EN IEC 60749 ‑ 15 about? BS EN IEC 60749 ‑ 15 is the 15th part of Semiconductor devices in multi-series. BS EN IEC 60749 ‑ 15 describes a test used to determine whether encapsulated solid…

Semiconductor devices — Mechanical and climatic test methods - Bond strength — wire bond pull test methods

1 Scope This part of IEC 60749 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be…

Semiconductor devices. Mechanical and climatic test methods - Standard reliability testing methods of non-vol…

What is BS EN IEC 60749 ‑ 41 about? BS EN IEC 60749 ‑ 41 is the 41st part of Semiconductor devices in multi-series BS EN IEC 60749 ‑ 41 specifies the procedural requirements for performing valid endu…

Semiconductor devices — Mechanical and climatic test methods - Bond strength — Wire bond shear test methods

1 Scope This part of IEC 60749 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devi…

Semiconductor devices. Mechanical and climatic test methods - Vibration, variable frequency

What is BS EN IEC 60749-12 - Variable frequency vibration of semiconductor devices about? BS EN IEC 60749 is an international standard on semiconductor devices. BS EN IEC 60749-12 is the 12th part in…

Semiconductor devices. Mechanical and climatic test methods - Preconditioning of non-hermetic surface mount d…

What is BS EN IEC 60749 ‑ 30 about? BS EN IEC 60749 ‑ 30 is the 30th part of the multimerise Internation standard on semiconductor devices. BS EN IEC 60749 ‑ 30 establishes a standard procedure for d…

Semiconductor devices. Mechanical and climatic test methods - Power cycling test for power semiconductor modu…

1 Scope This part of IEC 60749 describes a test method that is used to determine the capability of power semiconductor modules to withstand thermal and mechanical stress resulting from cycling the po…

Semiconductor devices. Mechanical and climatic test methods - Ionizing radiation (total dose)

Semiconductor devices. Mechanical and climatic test methods - Salt atmosphere

What is BS EN IEC 60749-13 – Salt atmosphere test for semiconductor devices about? BS EN IEC 60749 is an international standard on semiconductor devices. BS EN IEC 60749-13 is the 13 th part of the s…

Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the…

What is BS EN IEC 60749 ‑ 20 about? BS EN IEC 60749 ‑ 20 is the 20th part of semiconductor the multi-series European standard on semiconductor devices. BS EN IEC 60749 ‑ 20 provides a means of assess…

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensiti…

Overview IEC 60749-26:2018 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating the electrostatic discharge (ESD) s…

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encap…

Overview IEC 60749-35:2006 is an international standard developed by the International Electrotechnical Commission (IEC), focusing on the procedures for performing acoustic microscopy on plastic enca…

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Overview IEC 60749-22:2002 is an international standard established by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor device…

Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-flu…

Overview IEC 60749-11:2002 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies the test method for rapid change of temperature on semiconducto…

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity a…

Overview IEC 60749-39:2006 is an international standard published by the International Electrotechnical Commission (IEC) focusing on semiconductor devices. Specifically, it addresses mechanical and c…

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subasse…

Overview IEC 60749-10:2022 is an internationally recognized standard that outlines mechanical shock test methods for semiconductor devices and subassemblies. Issued by the International Electrotechni…

Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

Overview IEC 60749-2:2002 is an international standard published by the International Electrotechnical Commission (IEC) that defines the mechanical and climatic test methods focused on low air pressu…

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accele…

Overview IEC 60749-4:2017 defines the Highly Accelerated Stress Test (HAST) - a damp-heat, steady-state test method used to evaluate the reliability of non-hermetic packaged semiconductor devices in…

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a…

Overview IEC 60749-40:2011 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a standardized method for board level drop testing of surface m…

Semiconductor devices - Mechanical and climatic test methods - Part 1: General

Overview IEC 60749-1:2002 is an international standard published by the International Electrotechnical Commission (IEC) focusing on semiconductor devices. This standard provides the general provision…

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Overview IEC 60749-21:2025 - Semiconductor devices: Mechanical and climatic test methods - Part 21: Solderability defines a standardized procedure for verifying the solderability of device package te…

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensiti…

Overview IEC 60749-26:2025 - Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) - defines a standardize…

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias…

Overview IEC 60749-5:2023 - "Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady‑state temperature humidity bias life test" specifies a destructive, steady‑state temperature…

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

Overview IEC 60749-42:2014 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor devices,…

Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconduc…

Overview IEC 60749-38:2008 is an international standard developed by the International Electrotechnical Commission (IEC) that details test methods for evaluating the susceptibility of semiconductor m…

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature f…

Overview IEC 60749-15:2010 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods to evaluate the resistance…

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and sh…

Overview IEC 60749-20-1:2009 sets the international requirements for handling, packing, labeling, and shipping of non-hermetic surface-mount devices (SMDs) sensitive to both moisture and soldering he…

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity a…

Overview IEC 60749-39:2021 - "Semiconductor devices - Mechanical and climatic test methods - Part 39" defines standardized laboratory procedures for measuring moisture diffusivity and water solubilit…

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated…

Overview IEC 60749-31:2002 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating the flammability of plastic-encapsu…

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unb…

Overview IEC 60749-24:2025 - "Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST" specifies an unbiased Highly Accelerated Stress…

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

Overview IEC 60749-29:2011 is an international standard published by the International Electrotechnical Commission (IEC) that defines mechanical and climatic test methods specifically focused on the…

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

Overview IEC 60749-18:2019 - "Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)" defines test procedures for characterizing packaged semiconducto…

Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods…

Overview IEC 60749-41:2020 is an international standard that defines standard reliability testing methods for non-volatile memory devices, specifically focusing on semiconductor devices. Published by…

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature f…

Overview IEC 60749-15:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through‑hole mounted devices - defines a reproducible sold…

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead inte…

Overview IEC 60749-14:2003 is an international standard developed by the International Electrotechnical Commission (IEC) for testing the robustness and lead integrity of semiconductor device terminat…

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

Overview IEC 60749-9:2017 specifies methods to assess the permanence of marking on solid-state semiconductor devices. The standard is intended to verify that device markings remain legible after expo…

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Overview IEC 60749-8:2002 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods focused on the sealing and…

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SM…

Overview - IEC 60749-20:2020 (Resistance of plastic encapsulated SMDs to moisture and soldering heat) IEC 60749-20:2020 is the International Electrotechnical Commission standard that defines a destru…

Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unb…

Overview IEC 60749-33:2004 defines the unbiased autoclave method for accelerated moisture-resistance testing of non-hermetic semiconductor packages. The test uses a condensing, high-humidity, elevate…

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement…

Overview IEC 60749-7:2025 - "Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases" defines a destructi…

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SM…

Overview IEC 60749-20:2008 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on semiconductor devices. Specifically, it addresses the mechanical a…

Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semico…

Overview IEC 60749-34-1:2025 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a power cycling test method for power semiconductor modules.…

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

Overview IEC 60749-18:2002 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating the effects of ionizing radiation (…

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear tes…

Overview - IEC 60749-22-2:2025 (Wire Bond Shear Test Methods) IEC 60749-22-2:2025 specifies standardized wire bond shear test methods to determine the strength of a ball bond to a die or package bond…

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensiti…

Overview IEC 60749-28:2017 - "Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level" de…

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test…

Overview IEC 60749-22-1:2025 is a critical international standard from the International Electrotechnical Commission (IEC) detailing mechanical and climatic test methods for semiconductor devices, sp…

Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

Overview IEC 60749-17:2003 is an international standard issued by the International Electrotechnical Commission (IEC) that defines mechanical and climatic test methods for semiconductor devices, focu…

Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualifi…

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surfa…

Overview IEC 60749-30:2020 - "Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non‑hermetic surface mount devices prior to reliability testing" - defines a s…