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What is BS EN IEC 61189 ‑ 5 ‑ 601 about? BS EN IEC 61189 ‑ 5 ‑ 601 is a part of the BS EN IEC 61189 multi-series that focuses on test methods for PCBs. BS EN IEC 61189 ‑ 5 ‑ <span data-contrast="auto…
What is BS EN IEC 61189-5-503- CAF testing of circuit board about? BS EN IEC 61189 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. T…
1 Scope This part of IEC 61189 specifies a test method to determine the decomposition temperature ( T d ) of base laminate materials using thermogravimetric analysis (TGA).
What is BS EN IEC 61189 ‑ 5 ‑ 501 about? BS EN IEC 61189 ‑ 5 ‑ 501 is used to quantify the deleterious effects of flux residues on the surface insulation resistance (SIR) in the presence of moisture.…
What is BS EN IEC 61189 ‑ 5 ‑ 504 about? BS EN IEC 61189 covers test methods for electrical materials, printed board and other interconnection structures and assemblies. BS EN IEC 61189 ‑ 5 ‑ 504 is…
1 Scope This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience und…
What is BS EN IEC 61189 ‑ 5 ‑ 502 about? BS EN IEC 61189 ‑ 5 ‑ 502 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coup…
1 Scope This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomecha…
1 Scope This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this e…
What is BS EN IEC 61189 ‑ 2 ‑ 630 - Test methods for materials for interconnection structures about? BS EN IEC 61189 ‑ 2 ‑ 630 is an international standard that discusses test methods for electric ma…
1 Scope This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.…
1 Scope This part of IEC 61189 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the therma…
What is BS EN IEC 61189 ‑ 5 ‑ 301 about? BS EN IEC 61189 ‑ 5 ‑ 301 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder…
Overview IEC 61189-2-807:2021 is an international standard published by the International Electrotechnical Commission (IEC) that specifies a test method for determining the decomposition temperature…
Overview IEC 61189-2-720:2024 is an international standard published by the International Electrotechnical Commission (IEC). It specifies a test method for detecting defects in electrical interconnec…
Overview IEC 61189-5-301:2021 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies general test methods for soldering paste using fine solder p…
Overview IEC 61189-3-913:2016 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies test methods for measuring the thermal conductivity of print…
Overview IEC 61189-5-501:2021 is an international standard developed by the International Electrotechnical Commission (IEC) that establishes general test methods for assessing the surface insulation…
Overview IEC 61189-2-809:2024 specifies a standardized test method for determining the X/Y coefficient of thermal expansion (CTE) in thick electrical insulating base materials using thermomechanical…
IEC 61189-11:2013 Overview IEC 61189-11:2013 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for measuring the melting temper…
Overview IEC 61189-2-719:2016 is an international standard published by the International Electrotechnical Commission (IEC). It specifies precise test methods for measuring the relative permittivity…
Overview IEC 61189-2:2006 is an International Electrotechnical Commission (IEC) standard that catalogs test methods for materials used in interconnection structures, including printed boards (PCBs),…
Overview IEC 61189-5-1:2016 is an essential international standard published by the International Electrotechnical Commission (IEC) that provides comprehensive test methods for electrical materials,…
Overview IEC 61189-2-805:2024 is an International Electrotechnical Commission (IEC) standard that specifies the test method for determining the X/Y coefficient of thermal expansion (CTE) of thin elec…
Overview IEC 61189-5-504:2020 is an international standard published by the International Electrotechnical Commission (IEC). This standard defines a general test method, known as Process Ionic Contam…
Overview IEC 61189-3-719:2016 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies test methods for monitoring the electrical resistance of sin…
Overview IEC 61189-2-803:2023 is an international standard published by the International Electrotechnical Commission (IEC). This standard defines a test method for measuring the Z-axis expansion of…
Overview IEC 61189-5-3:2015 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies general test methods for soldering paste used in printed board…
Overview IEC 61189-2-804:2023 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for determining the time to delamination of ele…
Overview IEC 61189-2-721:2015 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for determining key electrical properties of co…
Overview IEC 61189-2-808:2024 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a test method for characterizing the thermal resistance of a…
Overview IEC 61189-2-501:2022 is an international standard published by the International Electrotechnical Commission (IEC) that defines test methods for evaluating the mechanical resilience of flexi…
Overview IEC 61189-5-503:2017 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503 defines a general test method for Conductive Anod…
Overview IEC 61189-5-502:2021 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies general test methods for materials and assemblies, focusing…
Overview IEC 61189-2-801:2023 is an international standard published by the International Electrotechnical Commission (IEC) that specifies a reliable method for assessing the thermal conductivity of…
Overview IEC 61189-5-2:2015 is a key international standard developed by the International Electrotechnical Commission (IEC) that outlines general test methods for soldering flux used in printed boar…
Overview IEC 61189-3-302:2025 specifies a standardized, non‑destructive test method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT). Applicable to me…
Overview IEC 61189-5-601:2021 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies test methods related to reflow soldering ability and heat re…
Overview IEC 61189-2-630:2018 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a test method to determine the amount of water absorbed by m…
Overview IEC TR 61189-5-506:2019 is a Technical Report from the IEC that documents an intercomparison study to support the development of IEC 61189-5-501. The report validates the introduction of a f…
Overview IEC 61189-3:2007 is the IEC catalogue of standardized test methods for interconnection structures (printed boards / PCBs). Edition 2.0 (2007) provides a self-contained set of methodologies a…
Overview IEC 61189-5-4:2015 is an international standard published by the International Electrotechnical Commission (IEC) that specifies general test methods for solder alloys and fluxed and non-flux…